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There's some news that the problem with 20nm is big, both NVIDIA and AMD are delaying their next generation GPU's by 1 quarter, while those GPU's are larger and needs slightly different process than mobile, but these are harder also do to larger size of the die ( the larger the die, the more bad yield to have )... both might be targeting 2Q15 instead of 1Q15...
TSMC main focus now is the mobile segment with new customers mainly Qualcomm, but they're expecting Apple also this is good as the mobile SoC are smaller and tends to be a good way for TSMC to master the yields...
It's seems that the situation of 20nm is hard for every body, making delays for every one... but from the news it's just a normal problems with any new process... the delays floating around 3 months ( 1Q ), so expecting the devices to be on time with limited supply or delayed by 1Q with better supply...
I just hope the the limited supply will not mean bad chips like hot or power hungry...
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Posted: 2014-12-27 10:18:11
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supercoolman Posts: > 500
On 2014-12-27 10:18:11, Xajel wrote:
There's some news that the problem with 20nm is big, both NVIDIA and AMD are delaying their next generation GPU's by 1 quarter, while those GPU's are larger and needs slightly different process than mobile, but these are harder also do to larger size of the die ( the larger the die, the more bad yield to have )... both might be targeting 2Q15 instead of 1Q15...
TSMC main focus now is the mobile segment with new customers mainly Qualcomm, but they're expecting Apple also this is good as the mobile SoC are smaller and tends to be a good way for TSMC to master the yields...
It's seems that the situation of 20nm is hard for every body, making delays for every one... but from the news it's just a normal problems with any new process... the delays floating around 3 months ( 1Q ), so expecting the devices to be on time with limited supply or delayed by 1Q with better supply...
I just hope the the limited supply will not mean bad chips like hot or power hungry...
consider intel delayed the current node for over a year, things may not be that optimistic.
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Posted: 2014-12-27 12:00:02
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Am I the only one here who still thinks there will be no delays to SD810?i'm even willing to bet.lol
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Posted: 2014-12-28 10:33:29
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On 2014-12-28 10:33:29, josephnero wrote:
Am I the only one here who still thinks there will be no delays to SD810?i'm even willing to bet.lol
I also believe there will be no delays.
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Posted: 2014-12-28 10:47:31
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No real delays so far but Sony is experiencing a lot of trouble with the S810 chipset thermal management
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Posted: 2014-12-28 11:30:10
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On 2014-12-28 11:30:10, randomuser wrote:
No real delays so far but Sony is experiencing a lot of trouble with the S810 chipset thermal management
Not surprised.
More powerful chips running at higher and higher clock-speeds. Bound to get hot.
I don't understand why Qualcomm or whoever, don't just licence ARM's cores and build larger multi-threaded cores, which run at lower clock speeds...Would be better for thermal management.
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Posted: 2014-12-28 11:55:32
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On 2014-12-28 11:30:10, randomuser wrote:
No real delays so far but Sony is experiencing a lot of trouble with the S810 chipset thermal management
if it is running hotter than the current crop of SDs, then this comes as no surprise.
@-XYZ
I think the 810 is just a regular arm core, the older 805, 801 and 800 and previous SDs used Qualcomm's own designs for the cores, Krait, whereas the 810 and 808 use the normal ARM cores since Qualcomm had no time in designing their own 64bit cores. This is what I recall reading some times ago.
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Posted: 2014-12-28 12:01:18
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supercoolman Posts: > 500
On 2014-12-28 11:30:10, randomuser wrote:
No real delays so far but Sony is experiencing a lot of trouble with the S810 chipset thermal management
sony better keep the IP rating and seal things properly so we can at least wash it with cold water
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Posted: 2014-12-28 12:12:28
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On 2014-12-28 11:30:10, randomuser wrote:
No real delays so far but Sony is experiencing a lot of trouble with the S810 chipset thermal management
heat is one of the rumoured issues actually... and normally Sony will worry more duo to their IP sealing and the slim profile of their designs...
@-XYZ
Qualcomm does have a license, and they used it before for low-end SoC but they used to have their own core design to make a different... but the 64bit rush forced them to use the stock ARM designs.. yes the 810 + 808 are original ARM designs already. the only different Qualcomm have is the GPU which is in-house and not ARM design.
Multiple low power cores are good, but not as an application processor, it's good for graphics and other highly parallel applications. at least not this time with current OS and applications... in the mobile applications there's no need actually to go this far in the parallel route as there's no need in 95% of cases if not more.
I think the best option is the Apple route, building a higher IPC core designs and use 2 - 4 cores with more power management control... the higher IPC will mean lower clock is needed to reach the target performance
big.LITTLE can be used also but with modified cores but don't expect octa-cores with such design as higher IPC core designs tends to be large in die size...
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Posted: 2014-12-28 12:52:03
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The over heating issue on the Z4 is more severe due to a combination of factors - fully sealed water resistant body, large camera sensor + lens assembly, and a thin body.
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Posted: 2014-12-28 15:03:29
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