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On 2015-06-10 15:37:50, badassmam wrote:
SD820 or even Mediatek would be a better option.
Mediatek? No way, all Mediateks have rubbish GPUs.
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Posted: 2015-06-10 16:08:31
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a s810 v3 on 14nm chip set maybe.
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Posted: 2015-06-10 17:46:14
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On 2015-06-10 14:02:49, pmugghc wrote:
This may be about existing phones, but I think it's very relevant for any discussion about Xperias launched in 4Q. Basically DoCoMo is warning its customers about overheating for phones using the 810:
http://www.phonearena.com/new[....]s-to-back-up-your-data_id70299
The Z4/Z3+ is using the 810 V2.1, but it is throttling on consecutive runs. The problems seem to be surfacing when you do 4k recordings or playing games.
http://www.gsmarena.com/sony_xperia_z3plus-review-1261p5.php
So what SoC can Sony use for any high-end in 4Q? The 820 may be ready at the very end of the year, but in which quantity?
[ This Message was edited by: pmugghc on 2015-06-10 13:15 ]
WOW!
Where are the people who were blaming another Android phone OEM for trying to damage Qualcomm's rep. with the overheating rumors now? Humble pie well served, by a Japanese carrier no less. And then there were those who claimed the Z3+/Z4 were coming with one that doesn't heat up.
I said it a while ago, that Snapdragon 810 is a dud, Samsung have a super close relationship with Qualcomm, so when even the U.S. variant of the S6 were Exynos you should know that there is a big problem with the Qualcomm chip, and it has all unravelled in the past few weeks.p
Qualcomm should have tweaked the Snapdragon 805 a bit, the 805 phones perform brilliantly with very little heat plus a GPU that is more powerful than the 808,I should know, I own a phone that uses a 805, heat and throttling are no issue unless you really try hard to hammer it. The 820 cannot arrive soon enough.
This is quite amusing and worrying at the same time:
NTT DoCoMo basically advises that to be on the safe side when it comes to overheating your handsets with Qualcomm's fastest chipset, you should shut them down while charging, and back up data on the phones against the most dreadful of scenarios, or even switch to tablets when you are at home, for instance.
[ This Message was edited by: Tsepz_GP on 2015-06-10 17:03 ]
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Posted: 2015-06-10 17:57:26
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Sony probably won't adopt Type-C anytime soon. Also, looks like they're planning to reduce thickness of the camera module even further. Good chance sensor size won't be increasing, possibly decreasing. I'm not liking the sound of this. :
http://focustaiwan.tw/news/ast/201506090029.aspx[ This Message was edited by: MNX1024 on 2015-06-10 18:06 ]
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Posted: 2015-06-10 19:04:19
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if they want that to be in the future of the Z line, it got to be water proof. Unless they have 2 usb ports, one hidden in the flap and a regular expose water proof micro usb at the bottom like Z3+.
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Posted: 2015-06-10 19:20:51
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Looks like leaks will be VERY hard to come by from now on. For those who are following SAR, they just got hit with the sudden release of the A7rII, RX10M2, and RX100M4. Man, the A7rII is very tempting at this point, might not be able to hold up for their A7sII.
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Posted: 2015-06-10 19:48:38
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On 2015-06-10 19:04:19, MNX1024 wrote:
planning to reduce thickness of the camera module even further. Good chance sensor size won't be increasing, possibly decreasing. I'm not liking the sound of this. :
http://focustaiwan.tw/news/ast/201506090029.aspx
[ This Message was edited by: MNX1024 on 2015-06-10 18:06 ]
This is not good, if the module is decreased fine, but the sensor size has to stay 1/2.4 at least, I doubt we will get OIS if the module is too thin, because there won't be space for it. We'll see, so far nothing has leaked but we know there are more models coming, so soon, hopefully soon some brave soul leaks something.
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Posted: 2015-06-10 21:03:56
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their eyeball sensor is suppose to decrease the thickness of the module since it require less lens but they don't seems to be using that.
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Posted: 2015-06-10 21:13:50
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On 2015-06-10 21:03:56, ascariss wrote:
This is not good, if the module is decreased fine, but the sensor size has to stay 1/2.4 at least, I doubt we will get OIS if the module is too thin, because there won't be space for it. We'll see, so far nothing has leaked but we know there are more models coming, so soon, hopefully soon some brave soul leaks something.
When they're talking about the module, it should mean the whole package of the camera. If they try to make it thinner, there's really two routes, reduce sensor size which means a smaller lens can be used or just reduced lens size. Neither is very desirable. As reducing sensor size mean lower light sensitivity and smaller lens compromises the photo quality. As you mentioned, OIS will probably be omitted if they are striving for a smaller package.
On 2015-06-10 21:13:50, Gitaroo wrote:
their eyeball sensor is suppose to decrease the thickness of the module since it require less lens but they don't seems to be using that.
Eyeball sesnor?! Do you mean their curve sensor?
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Posted: 2015-06-10 21:38:33
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On 2015-06-10 21:03:56, ascariss wrote:
On 2015-06-10 19:04:19, MNX1024 wrote:
planning to reduce thickness of the camera module even further. Good chance sensor size won't be increasing, possibly decreasing. I'm not liking the sound of this. :
http://focustaiwan.tw/news/ast/201506090029.aspx
[ This Message was edited by: MNX1024 on 2015-06-10 18:06 ]
This is not good, if the module is decreased fine, but the sensor size has to stay 1/2.4 at least, I doubt we will get OIS if the module is too thin, because there won't be space for it. We'll see, so far nothing has leaked but we know there are more models coming, so soon, hopefully soon some brave soul leaks something.
A thinner module would make having OIS easier.....More space to put the mechanism......
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Posted: 2015-06-10 22:07:46
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