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Ricky D Posts: > 500

I'm not sure the footprint of the chip is the biggest issue in overheating from the aspect of spreading the heat.

We have to think about how the heat is generated. The 28nm compared to 14nm is describing the width of the path through the transistors that the electrons have to pass. The pathways are half the width in the newer chips. This will equate to about twice the electrical resistance. That resistance translates into heat as current is passed through.

So why aren't the chips twice as hot?

If the chips were the same size and architecture but simply reduced the pathways to half the width, they would be, but because the designers are learning from old mistakes and reducing the space between the transistors (possible because they are smaller), the electrons have a shorter distance to travel per any given task. The chip doesn't work as long as it would have per task and this hides some of the effect of higher resistances.

At least that's how I understand it.
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Posted: 2015-10-28 14:54:33
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Gitaroo Posts: > 500

shrinking die size ALWAYS decrease the heat generation actually. Look at all intel line up, new one are even fanless.
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Posted: 2015-10-28 16:11:52
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Jamzy Posts: 143


On 2015-10-28 06:20:27, supercoolman wrote:
http://www.amazon.com/gp/product/B015JWFNX2
http://www.amazon.com/gp/product/B015JWFOG8

so Z5 is coming to US after all?


That really doesn't mean much.
Case manufacturers are just targetting those who imported their phones
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Posted: 2015-10-28 18:09:24
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Wishmaster89 Posts: 333


On 2015-10-28 16:11:52, Gitaroo wrote:
shrinking die size ALWAYS decrease the heat generation actually. Look at all intel line up, new one are even fanless.

It's not about heat generation but about it's dissipation, besides in case of intel their new CPU's can be fanless cause they were designed this way - lower voltage, reduced performance, turbo mode.

Few years ago I remember reading an article about intel having to revise their cooling solutions to accomodate for the smaller chips and more efficient ways of removing the heat from CPU.

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Posted: 2015-10-28 18:30:26
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supercoolman Posts: > 500

I would recommend people to take at least some modern semiconductor courses before starting to speculate like madness

there are multiple sources of heat generation, but switching (hence frequency) and leakage are the two significant to name these days. leakage gets worse as you shrink the node due to physics. modern transistors aren't as simple as you think, so you need some basics on different modern transistor structure such as finfet, carbon nanotube...etc before you start commenting on this topic
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Posted: 2015-10-29 06:57:59
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nodarsixar Posts: > 500

Z5 Spectre

https://www.youtube.com/watch?v=kjisV3QrhSs
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Posted: 2015-10-31 14:11:05
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nodarsixar Posts: > 500

Bwat GPU smartphones

http://review.ge/?p=6757
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Posted: 2015-11-01 20:52:09
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Ricky D Posts: > 500

Time to look towards next year's thread.

Anybody want to run it?
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Posted: 2015-11-02 13:15:08
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goldenface Posts: > 500

It could be the last. Time it's flying by.
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Posted: 2015-11-02 13:44:28
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thetube Posts: 207

After Sony building a factory, don't think it will be the last. We should have couple more ) at least 2.

Well I am really curious about the Z5 Ultra this year. I would run it but don't have a pc right now. .

Z Ultra side-effects.
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Posted: 2015-11-02 13:49:00
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