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Having a look through Twitter and come across this account while searching the Xperia hashtag, could be genuine could be completely false but does tie in with previous rumors either way it's interesting.



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Posted: 2014-11-30 19:36:03
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@XperiaJunkie That's like a dream spec! I find it a little unbelievable for it to be 7.2mm thin, with the S-Master amp, and such a large battery. If true, I welcome it. Now, I'm actually more interested in the Ultra than anything at this point, any news on that? I just hope it keeps the physical shutter button, same sensor, and some sort of flash/light.
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Posted: 2014-11-30 22:57:33
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There might be a reason why it is only SD805 and not 810

@evleaks tweeted “Slated for a first quarter 2015 launch, the HTC M9 and HTC M9 Prime will be the next full refreshes of the One Max family.”

I can't seem to find the tweet on his account, maybe it is an old one.


http://en.mobi4all.com/latest[....]rumors-release-date-and-specs/

So different specs here, source is here from nov 22nd. The sites states 808 or 810, nothing about 805. Although I thought the 808 was due much later than the 810.

Some random tweets mention a January 2015 launch or debut, and available in first quarter, so first 3 months, and since the 810 is not due until late Q1, it would mean the M9 would be too early to have it. Other sites mentjon a MWC debut, would would still be in the 1st quarter and the M9 could come with the 810. HTC knows others like Samsung and Sony will feature the 810 (if it is not delayed), so HTC knows they need to be on top of the game as well with the 810.

Whatever the specs, 805 or 810 or 808, HTC can't get their next device wrong, otherwise their bottom line won't be looking too good. Perhaps HTC want to be earlier to market to get ahead with sales but I doubt 1-2 months extra will lead more sales when people will wait for S6 and perhaps Z4.

I thought the point of Lollipop was to move to 64bit architecture and not stick to the older CPUs. Releasing a device with 805 would not be future proofing it enough i feel.

More info on 810 dev kits
http://linuxgizmos.com/androi[....]y-octacore-snapdragon-designs/

Regardless, right now things are up in the air regarding actual concrete specs for the Z4. No doubt, Sony is themselves leaking false information to "insiders" to mislead and misdirect. I am sure Sony has learned from the past (at least I hope) that shipping with an older processor is not good for the long term. Anywyas, just throwing out ideas to keep the discussion going.

One final question on my part, would overheating be an issue with a 20nm process? I thought that by having a smaller process helps reduce the heat in a cpu by reducing the power consumption and lowering voltage? As for any problems with little big, is this the same thing samsung had, where the global task scheduling didn't work? I doubt qualcomm would have issue with this just now and not earlier in the development. And if there were problems with big.LITTLE, the problems would have shown up during the development would they not? Also from what I recall, the 810 is not a custom chip design like the previous Snapdragons, and it mostly just an ARM design.

As for Ram frequency problems? Is this due to the LPDDR4 ram? Not idea how frequency plays a role in ram, but I feel this is solved with the new arm instructions v8? Maybe I am mistaken. I feel there is no RAM issue personally.

http://en.wikipedia.org/wiki/Big.LITTLE_Config

Again, wouldn't Qualcomm delay the development kits if there were problems with the ram or any other part of the SoC? It ships to developers in mid december, and has already been sampled to manufacturers so unless there are any delays the companies are keeping it quiet, because I feel such news as a problem with the SD810 would leak no?

Anyways, whatever will happen, will happen and there is nothing we can do about it.

As MNX1024's post, I feel 7.2mm is thin, especially with such a large battery which will not be needed, but still possible. Look at this way, new CPU, 20nm, new lower power ram, and more efficient GPU. This all results in much decreased power consumption. Assuming Sony is smart (not always the case) and uses a very good screen with less power consumption than the current screen on the Z3, then again more efficiency there. The other issue is the cellular modem, it is again a new modem, so hopefully this uses less energy as well. I am sure the rest of the components will be smaller meaning he device can get thinner and smaller but again there are limits and physics can't be broken. The thickness of the Z4 will probably be mainly determined by the size of the sensor module and how small it will be. If the rumours that the new 1/2.4 sensor will not arrive in time, and the current 1/2.3 will be in its place, then thickness will be similar to the Z3, perhaps a few mm thinner. Z3 is 7.3, so 7.2mm is possible if all components shrink and the battery can be slightly smaller, yet still deliver similar battery life.

As for any S-master amp, look at the M-series walkman, that features a S-master amp and it is a small device
http://ascii.jp/elem/000/000/846/846689/

Here it is taken apart, http://ascii.jp/elem/000/000/846/846726/img.html

Sony could fit it into the Z4, question is, do they want to? Ok I think this is enough writing for one night.
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Posted: 2014-11-30 23:14:33
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The jump up in battery capacity isn't that much, 3100 mAh to 3350 mAh in a larger 5.5" display would be more than possible I feel.
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Posted: 2014-12-01 00:01:20
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@ascariss

Every thing is possible at this point as we don't have any solid rumour around, both the news about 810 and 805 are strong and this is why we're thirsty for any more info.

regarding that M9 might either come with 64GB or 128GB, now I feel Sony should not move to 32GB, but directly to 64GB instead... it's Apple and HTC, and I'm sure Samsung will also do the jump, while HTC jumped to 32GB a while ago skipping any 16GB versions, Apple skipped the 32GB and offered 16GB to satisfy the carriers and 64GB and 128GB to satisfy them selfs... Samsung started to offer 16GB and 32GB for their devices...

Sony is like HTC, doesn't provide multiple options.. so it's either 32GB or 64GB.. and now looking that all other major makers are moving to 64GB I hope Sony will make the big jump and skipping 32GB all together...


Regarding over heating, it's not about 20nm, it's about optimising the design : after designing the masks and these stuff for manufacturing, the fabs ( the manufacturing plant for semiconductors are called fabs ) will not move directly to production, instead it will create multiple samples in corporation with the maker/design these samples might not work at all in the beginning, so they will commit few changes to the design and re do it again, it might need few different changes to the design in order to get the right changes... but sometimes a whole patch that depends on a specific design might work perfectly except overheating... overheating comes normally from electrons leaks within the design lowering the working freq. duo to increased noise and increasing the heat duo to waste of power with these leaks... more changes to the design is needed to avoid such leaks...

Even the development samples might be not the final silicon, and even after delivering the product successfully, they will optimise it further and re produce it in order to gain more power ( increase the freq. for example without increasing power/heat )

The Samsung issue they had was much worse, the scheduler was faulty as it didn't know when to switch the cores, and that octa core design wasn't capable of running all the 8 cores together do to incomplete big.LITTLE implementation... that chip was released way before any other maker released octa-core so we can safely say that the design was actually not production-ready but they just used it in their products ( at least the Galaxy S4 i9500 )... and soon after they released another chip with exactly same spec. but different model number which was not faulty and worked normally...


Regarding the spec. I feel these are plausible if we take into account the larger screen which will be able to spread more components without increasing the Z height, or even making it even slimmer, and as said... 0.1mm is not that much of a different to make us wonder !!
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Posted: 2014-12-01 06:26:23
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I have no doubt that z4 devices will have the spec mentioned in the twitter message above. 7.2mm sound believable for a 5.5" device because it has bigger surface, as opposed to that "tipster" info that phonearena mentioned that said 5.7mm for ultra which is obviously false info.
regarding s810, there is plenty of time for sony to test and equip it in z4 devices as they will be released worldwide in april=q2. only the announcement will be in march.

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Posted: 2014-12-01 11:47:25
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No, I can't imagine the Z4 Ultra taking that much of a drop in thinness but Sony is capable of surprising us so it's not completely out of the question.
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Posted: 2014-12-02 14:20:24
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Another possible leak from that Twitter account that mentioned the Z4 spec. Very plausible specs, intrigued in the "Walkman" side of it.

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Posted: 2014-12-02 15:09:19
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Can we expect a z4 compact early 2015? My contract expires in march. And I just dropped my ZR, cracking the frame. Should I hold on for the Z4 compact och go for z3 compact?
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Posted: 2014-12-02 15:09:47
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I suppose it depends on how much of an upgrade the Z4C specs will be. It's hard to imagine a huge jump in specs, may be a new lens for the camera, slightly slimmer, a slightly bigger screen. . . .

The leak above looks like something similar to the E1, with the dedicated Walkman button and loud speakers.
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Posted: 2014-12-02 16:40:15
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